BOND 007

Fabricante
Others
Categoría
Funguicidas
Registrado hasta el
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BOND 007 (HPM Chemicals) is a broad-spectrum systemic fungicide containing the active ingredient Tebuconazole 25.9% EC. It is specifically designed to control a wide range of fungal diseases in various crops, including cereals, pulses, fruits, and vegetables.

Key Features of BOND 007 (HPM Chemicals):

  • Broad-spectrum disease control: BOND 007 effectively controls a wide range of fungal diseases, including powdery mildew, rust, leaf spot, and blight, which cause significant damage to crops.

  • Systemic action: BOND 007 has systemic action, providing long-lasting protection against fungal diseases by penetrating the plant tissues and reaching the infection sites.

  • Protective and curative action: BOND 007 has both protective and curative action, preventing fungal infections and stopping the spread of existing infections.

  • Safe for the environment: BOND 007 is considered safe for the environment when used as directed and has a low impact on non-target organisms.

Benefits of using BOND 007 (HPM Chemicals):

  • Effective disease control: BOND 007 provides effective control of a wide range of fungal diseases, protecting crops from damage and yield loss.

  • Reduced disease pressure: Effective disease management reduces the overall disease incidence in the field, minimizing infection and improving crop performance.

  • Integrated disease management: BOND 007 can be incorporated into integrated disease management (IDM) programs for effective fungal disease control in various crops.

  • Improved crop quality: By controlling fungal diseases, BOND 007 helps in maintaining crop quality and enhancing marketability.

Application:

BOND 007 is applied as a foliar spray. The recommended application rate and timing vary depending on the crop, disease, and disease severity. Refer to the product label for specific application instructions.

Precautions:

  • Use only as directed: Follow the label instructions carefully and use BOND 007 only on crops and diseases as specified.

  • Prevent spray drift: Avoid drift to non-target crops and sensitive areas by using appropriate spraying techniques and adjusting nozzles.

  • Wear protective gear: Wear appropriate personal protective equipment, including gloves, eye protection, and long-sleeved clothing, when handling BOND 007.

  • Minimize exposure: Wash thoroughly after handling BOND 007 and avoid contact with skin and eyes.

  • Safe storage and disposal: Store BOND 007 in its original container in a cool, dry place, away from food, feed, and children's reach. Dispose of empty containers according to local regulations.

Always read and follow the label instructions carefully before using BOND 007 (HPM Chemicals).

Registrado para cultivos
Chile
Cacahuetes
Arroz
Cebollas
Soja
Gramos negros